Novel Process to Create Structured Membrane Films for Micromachining Applications

About this technology

Overview

Conventional micromachining and etching techniques used in microelectromechanical (MEMS) devices have several disadvantages such as the use of etch stop materials, the use of hazardous gases and specialized equipment, and localized heating effects. As a result, devices or membranes may be damaged or unnecessary redeposition of materials may be required. While wet etching is often employed to mitigate these issues, it presents its own challenges, such as the need to protect MEMS devices during the process and the risk of structural damage when forming openings in membranes. To address these limitations, a new process for protecting membranes during wet etching is needed. Researchers at NASA’s Goddard Space Flight Center have developed an innovative method for creating structured membrane films, enabling the micromachining of ultra-thin membranes and micro/nano-scale structures. This invention utilizes XHRiC in combination with a potassium hydroxide etch to produce an ultra-thin silicon nitride membrane with metal leads and precise membrane cuts.