Patent — available for licensing
Integrated Circuit Chips
A NASA invention available to explore as a licensing opportunity.
About this technology
Overview
Innovators at NASA's Glenn Research Center have developed a new generation of silicon carbide (SiC) logic and mixed signal integrated circuits (ICs), unprecedented in the field of high-temperature electronics. Previously, SiC ICs could not withstand more than a few hours of 500°C temperatures before degrading or failing. Now, NASA Glenn has successfully fabricated prototypes that consistently exceed 1,000 hours of continuous operation at 500°C. The superior performance stems in part from previous Glenn advancements, such as the iridium interfacial stack (IrIS), a bondable and durable metallization stack that enables electrical packaging connections to SiC integrated circuits operating above 500°C. The enhanced stability of these components will enable important improvements in sensing, control, and operation of harsh environment systems, by providing analog and digital circuit functionality directly where it is needed. This advancement in the manufacturing of SiC-based electronics revolutionizes and broadens the opportunities for intelligent systems by providing ICs that operate well beyond the current temperature limits of conventional (silicon) ICs.