Patent — available for licensing
Improved Indium Bump Bonding Using Multi-Step Plasma Process
A NASA invention available to explore as a licensing opportunity.
About this technology
Overview
Indium bump bonding is one standard method of connecting electronic chips to circuit boards. Indium solder bumps are deposited over contact pads of both the chip and the board, and then the contact pads are aligned and pressed together to form an electrically conductive bond. One issue with this technique is the formation of oxides on indium bumps when they are exposed to air. This oxide leads to resistance in the contact, limiting the electronic performance. NASA's Jet Propulsion Laboratory (JPL) has devised a unique multi-step plasma process to remove this oxide. Its key advantage is that it preserves the indium itself more effectively. This process could also lead to smaller contact pads and flip-chip circuits, which are of particular interest to any application requiring compact electrical systems.