Advanced Joining Technology: Simple, Strong, and Secure

About this technology

Overview

Work done at NASA's Langley Research Center in the realm of active solder joining has led to a new, self-bonding solder that enables high conductivity, as well as the metallic joining of carbon and ceramic materials to a wide range of metals. The original work involved evaluating high- and low- temperature joining technologies for joining carbon composite structures for use in thermal management and reusable launch vehicles. NASA scientists found use for this technology in fabricating a thermal management package for battery compartments in the Earth Observing System (EOS) satellites, but it is also being used by the Agency for space radiator panels. Because it is light, simple to use, and economical, NASA will likely find other uses for this solder, just as outside of the Space Agency, this unique bond is finding many useful applications. Materials Resources International (MRi), of Lansdale, Pennsylvania, teamed with researchers at Langley through a Phase II Small Business Innovation Research (SBIR) contract to commercialize this material. MRi's work with the new technology, S-Bond active solder, was so successful, that in 2002, it created a second company devoted just to this work. S-Bond Technologies LLC (SBT) now handles the manufacturing and distribution of this product.